Part 1 – The BGA Rework Process

 

BGA rework removes, cleans, and replaces a BGA component from an assembled PCB, typically due to manufacturing defects, failed solder joints, or design revisions. Our rework services follow strict thermal and mechanical protocols to ensure PCB and component integrity.

 

1.  Precision BGA Component Removal

 

Using programmable rework stations with custom thermal profiles, we safely heat and remove BGAs without damaging surrounding components or the PCB. Our vision-assisted systems ensure accurate alignment and zero mechanical stress.

 

2.  Pad Integrity & Surface Cleaning

 

Once the BGA is removed, our technicians inspect and clean the exposed PCB pads, removing residual solder using low-abrasion techniques, flux, and solder wick. Special care is taken to preserve the copper pad surface and surrounding solder mask.

We also utilize specialized PCB-cleaning machines, including ultrasonic and spray-in-air systems with deionized water, to remove ionic contamination and microscopic debris. This ensures a clean bonding surface for the replacement BGA or future processing.

 

3.  Re-tinning or Preparation for New BGA

 

We re-tin the BGA landing pads if necessary, using a mini reflow process or controlled solder paste application. This ensures uniform wetting and strong solder joints upon reassembly.

 

 4.  BGA Replacement and Reflow

 

A new or reballed BGA is aligned and reattached using automated optical alignment and precise reflow soldering, restoring the PCB to its functional state with full electrical and mechanical integrity.

 

 

Part 2 – The BGA Reballing Process

 

When a BGA is still functional but needs to be reused on a new board, it undergoes reballing—removing and replacing old solder balls with fresh ones. This is especially important for RoHS conversion, component recovery, or rework scenarios.

Our step-by-step BGA reballing process includes:

 

• Component Removal from PCB

• Deballing: Removing old solder balls

• Flux Application & Preheat Stabilization

• (Optional) Solder Wave Activation

• Stenciling with Solder Paste or Preformed Balls

• Ball Placement using Pick & Place

• Controlled Reflow Soldering

• Deionized Water Cleaning

• Final Optical/X-ray Inspection

 

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Why Choose JosephSan for BGA Rework and Reballing?

 

• Cost-effective recovery of high-value BGAs

• Cleanroom-level PCB pad cleaning and contamination control

• Strict thermal profiles for safe component handling

• High-resolution X-ray and optical inspection for quality assurance

• IPC-A-610 compliance for soldering and rework quality

 

We are committed to investing in best-in-class rework and cleaning machines to enhance our service quality and throughput as we expand our capabilities.

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